Printable Flexible Ceramic Fiber Paper Based on Electrospinning

This work proposes an innovative method of using printable ceramic fiber paper as a high-temperature flexible circuit substrate to solve the problem that traditional polymer flexible circuit substrates cannot meet the requirements of use in high-temperature environments. A ceramic fiber paper with full ceramic composition was developed by electrospinning, which solved the problems of low strength and serious strength decline of traditional ceramic fiber paper at high temperature. The tensile strength of the prepared ceramic fiber paper is 2.63 MPa, and the reliable operating temperature is 1200 ℃. Its bulk density is about 1.5 times that of traditional ceramic fiber paper, and it can print patterns with commercial inkjet printers like ordinary printing paper, with excellent printability. In addition, by constructing a simple circuit, the feasibility of using ceramic fiber paper as a flexible circuit substrate is verified. When the fiber paper is significantly bent, the circuit still forms a complete path, which proves its strong application potential in high temperature flexible circuit substrates, and is expected to promote the development of flexible electronic devices serving extreme high temperature environments.
1. A ceramic fiber paper with all ceramic components was prepared by a simple electrospinning method. Ceramic fiber paper has good flexibility and high strength. After high temperature treatment, the tensile strength has no obvious change and has excellent high temperature structural stability. Reliable use at a temperature of 1200°C;
2. This kind of ceramic fiber paper can use inkjet printer to print patterns like ordinary printing paper;
3. This ceramic fiber paper combines excellent temperature resistance and printability, and is expected to be used as a high-temperature flexible circuit substrate.